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词汇
directly wafer bonding
释义
directly wafer bonding
基本
例句
晶片直接键合
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
摘要晶片直接键合技术是材料集成的一项新工艺,是近年来集成光电子领域的研究热点之一。
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更新时间:2026/7/15 9:53:54